Display device comprising a protective fixing member disposed only about a periphery of a semiconductor chip wherein a top side and a bottom side are co-planar with a respective top side and a bottom side of the semiconductor chip

ABSTRACT

Disclosed herein is a display device including: a first substrate with a pixel switch and drivers mounted thereon; a second substrate disposed in facing relation to the first substrate; a material layer held between the first substrate and the second substrate and having peripheral edges sealed by a seal member, the material layer having an electrooptical effect; and a semiconductor chip mounted as a COG component on the first substrate, the semiconductor chip having a control system configured to control the drivers; wherein the semiconductor chip having a thickness equal to the total thickness of the seal member and the second substrate or larger than the thickness of the seal member and smaller than the total thickness.

CROSS REFERENCES TO RELATED APPLICATIONS

The present invention contains subject matter related to Japanese PatentApplication JP 2006-069539 filed in the Japan Patent Office on Mar. 14,2006, the entire contents of which being incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a display device, a method ofmanufacturing such a display device, and an electronic apparatus for usein a portable terminal such as a cellular phone, a PDA (Personal DigitalAssistant), or the like which is required to be of a low profile.

2. Description of the Related Art

One of the most important concerns for designing portable terminals isto make themselves low in profile. If a liquid crystal display devicefor use in a portable terminal display is thick, then it presents anobstacle to efforts to make the portable terminal low in profile.Therefore, there are growing demands for low-profile liquid crystaldisplay devices.

FIGS. 18A and 18B of the accompanying drawings schematically show across-sectional structure of a general liquid crystal display device.FIG. 18A shows an overall cross-sectional structure of a liquid crystalpanel 100, and FIG. 18B shows the cross-sectional structure in greaterdetail.

As shown in FIGS. 18A and 18B, the liquid crystal panel 100 includes atransparent insulating substrate (hereinafter referred to as “TFT (ThinFilm Transistor) glass substrate”) 101 supporting thereon pixel switchesand a driver circuit therefor which are constructed of TFTs, atransparent insulating substrate (hereinafter referred to as “facingglass substrate”) 102 disposed in facing relation to the TFT glasssubstrate 101, and a liquid crystal display (LCD) layer 106 held betweenthe TFT glass substrate 101 and the facing glass substrate 102 andsealed by a seal member 105.

In an attempt to make the liquid crystal panel 100 low in profile, asemiconductor chip 107 including a control circuit for controlling thedriver circuit is mounted as a COG (Chip On Glass) component on the TFTglass substrate 101. The semiconductor chip 107 will hereinafter bereferred to as “COG chip 107”.

The use of the COG chip 107 allows design efforts to be made to reducethe total thickness of the facing glass substrate 102, the TFT glasssubstrate 101, the seal member 105, and polarizing plate and phasedifference plate combinations 103, 104 mounted respectively on thefacing glass substrate 102 and the TFT glass substrate 101 and also tomake the COG 107 thin.

The thickness T1 (e.g., 390 μm) of the COG chip 107 has been designed tobe greater than the total thickness T2 (195 μm+80 μm=275 μm) of thepolarizing plate and phase difference plate combination 104, the facingglass substrate 102, and the seal member 105 (T1>T2). In FIG. 18A, theliquid crystal panel 100 has an overall thickness T0.

Many proposals have been made to reduce the thickness of liquid crystaldisplay devices.

For example, a liquid crystal display device has a liquid crystaldisplay panel whose opposite surfaces are polished to make itself thin,so that a plurality of liquid crystal display panels can be stackedtogether for displaying images (see Japanese Patent No. 3290379,paragraphs [0007] through [0013], FIG. 1, referred to as Patent Document1). After a liquid crystal display panel has been polished into a lowprofile, a COG chip is connected thereto (see Japanese Patent Laid-openNo. Hei 11-104954, paragraphs [0007] through [0009], FIG. 3, referred toas Patent Document 2). The thickness of a COG chip is smaller than thetotal thickness of a facing glass substrate and a seal member whichseals an LCD layer (see Japanese Patent Laid-open No. 2001-350421,paragraphs [0007] through [0008], FIG. 7, referred to as Patent Document3). Polarizing plate and phase difference plate combinations are in theform of polymer films mounted on a facing glass substrate and a TFTglass substrate by an adhesive (see Japanese Patent Laid-open No.2003-121641, paragraphs [0006] through [0007], referred to as PatentDocument 4). In order to increase the mechanical strength of a glasssubstrate in a mounting area for a TCP (Tape Carrier Package), thethickness of the glass substrate in a display area is reduced, and thethickness of the glass substrate in the TCP mounting area is increased(see Japanese Patent Laid-open No. 2003-241171, paragraphs [0007]through [0009], FIG. 1, referred to as Patent Document 5).

According to Patent Document 1, however, since a TCP is used as anexternal terminal, no consideration for the mounting of a COG chip hasbeen made. If a COG chip is mounted on a TFT glass substrate, then theheight of the COG chip is greater than the thickness of a facing glasssubstrate, making it difficult to reduce the thickness of the liquidcrystal panel.

According to Patent Document 2, the height of the COG chip may not bemade equal to or smaller than the height of a facing glass substrate.The disclosed liquid crystal panel is not suitable for making a liquidcrystal display device compact.

As shown in FIGS. 18A and 18B, the liquid crystal panel 100 is fittedwith a metal frame 200 serving as a protector for protecting the liquidcrystal panel 100 and as a light shield for preventing light fromleaking around the liquid crystal panel 100.

The metal frame 200 is vertically spaced from the liquid crystal panel100 by a space T6. The reasons for the space T6 are that if the metalframe 200 contacts the liquid crystal panel 100, then the TFT glasssubstrate 101 and the facing glass substrate 102 are deformed, producingcell gap nonuniformities or irregularities in display area, and if themetal frame 200 contacts the COG chip 107, then the COG chip 107 pressesthe TFT glass substrate 101, tending to increase the contact resistanceof the pad for the COG chip 107 or peel off the pad for the COG chip107.

If the TFT glass substrate 101 and the facing glass substrate 102 cannotignore the thickness of the COG chip 107, then the thickness of thespace T6 is determined by the thickness of the COG chip 107 whichincludes the driver circuit outside of the display area, rather than bybeing limited by the device (pixel switch) structure in the displayarea.

According to Patent Document 3, the liquid crystal panel is made low inprofile by making the thickness of the COG chip smaller than the totalthickness of the facing glass substrate and the seal member which sealsthe LCD layer.

Actually, however, the liquid crystal panel includes polarizing plateand phase difference plate combinations, and Patent Document 3 fails toshow that the thickness of the COG chip is smaller than the totalthickness including the thickness of the polarizing plate and phasedifference plate combinations. Depending on the thickness of thepolarizing plate and phase difference plate combinations, the metalframe which mechanically protects the peripheral edges of the liquidcrystal panel may possibly contact the COG chip. To avoid possiblecontact between the metal frame and the COG chip, an extra space needsto be provided between the liquid crystal panel and the metal frame.

According to Patent Document 4, polarizing plate and phase differenceplate combinations are simultaneously formed of polyester films toproduce a low-profile liquid crystal panel. However, the thickness ofthe films may not be reduced to a minimum because the adhesive and thefilms need to have a certain level of mechanical strength. Therefore,the proposal according to Patent Document 4 is not effective tomanufacture desired low-profile liquid crystal panels.

According to Patent Document 5, the polishing process is complex andinvolves an increased number of steps. In addition, the area surroundingthe pad area needs to be thicker than the TFT glass substrate and thefacing glass substrate.

As a result, though the structure proposed in Patent Document 5 isapplicable to large-size liquid crystal displays as large as at least 6inches, it may not be incorporated in smaller liquid crystal displaymodules because small-size, high-definition liquid crystal displaydevices as large as at most 6 inches require a polished area other thanthe pad area.

SUMMARY OF THE INVENTION

According to the embodiments of the present invention, it is desirableto provide a display device which employs a display panel that is lowerin profile and has a thickness determined by a device structure in adisplay area thereof, a method of manufacturing such a display device,and an electronic apparatus.

According to an embodiment of the present invention, there is provided adisplay device including a first substrate with a pixel switch anddrivers mounted thereon, a second substrate disposed in facing relationto the first substrate, a material layer held between the firstsubstrate and the second substrate and having peripheral edges sealed bya seal member, the material layer having an electrooptical effect, and asemiconductor chip mounted as a COG component on the first substrate,the semiconductor chip having a control system for controlling thedrivers, the semiconductor chip having a thickness equal to the totalthickness of the seal member and the second substrate or larger than thethickness of the seal member and smaller than the total thickness.

According to another embodiment of the present invention, there isprovided a display device including a first substrate with a pixelswitch and drivers mounted thereon, a second substrate disposed infacing relation to the first substrate, a material layer held betweenthe first substrate and the second substrate and having peripheral edgessealed by a seal member, the material layer having an electroopticaleffect, a semiconductor chip mounted as a COG component on the firstsubstrate, the semiconductor chip having a control system forcontrolling the drivers, and a protective fixing member disposed on atleast a portion of the first substrate laterally of the semiconductorchip, the semiconductor chip having a thickness equal to or smaller thanthe distance from a surface of the first substrate which faces thematerial layer to a surface of the second substrate which faces awayfrom the material layer.

According to yet another embodiment of the present invention, there isprovided a display device including a first substrate with a pixelswitch and drivers mounted thereon, a second substrate disposed infacing relation to the first substrate, a material layer held betweenthe first substrate and the second substrate and having peripheral edgessealed by a seal member, the material layer having an electroopticaleffect, a polarizing plate and phase difference plate combinationdisposed on the second substrate remotely from the material layer, and asemiconductor chip mounted as a COG component on the first substrate,the semiconductor chip having a control system for controlling thedrivers, the semiconductor chip having a thickness smaller than thetotal thickness of the seal member, the second substrate, and thepolarizing plate and phase difference plate combination.

Preferably, the display device further includes a protective fixingmember disposed on at least a portion of the first substrate laterallyof the semiconductor chip.

According to another embodiment of the present invention, there isprovided a display device including a first substrate with a pixelswitch and drivers mounted thereon, a second substrate disposed infacing relation to the first substrate, a material layer having anelectrooptical effect, a first polarizing plate and phase differenceplate combination disposed between the first substrate and the materiallayer, a second polarizing plate and phase difference plate combinationdisposed between the second substrate and the material layer, a sealmember holding the material layer between the first and secondpolarizing plate and phase difference plate combinations thereby to sealthe material layer, and a semiconductor chip mounted as a COG componenton the first substrate, the semiconductor chip having a control systemfor controlling the drivers, the semiconductor chip having a thicknessequal to or smaller than the total thickness of the first and secondpolarizing plate and phase difference plate combinations, the materiallayer, and the second substrate.

Preferably, the seal member is disposed between the first and secondpolarizing plate and phase difference plate combinations.

Preferably, the first and second polarizing plate and phase differenceplate combinations are disposed inwardly of a region in which thematerial layer is sealed by the seal member, the seal member beingdisposed between the first substrate and the second substrate alongsideof the first and second polarizing plate and phase difference platecombinations.

According to further embodiment of the present invention, there isprovided a method of manufacturing a display device having a firstsubstrate with a pixel switch and drivers mounted thereon, a secondsubstrate disposed in facing relation to the first substrate, and amaterial layer held between the first substrate and the second substrateand sealed by a seal member, including the steps of mounting asemiconductor chip having a control system for controlling the drivers,as a COG component on the first substrate parallel to a region in whichthe seal member and the second substrate are stacked, filling a spacearound the semiconductor chip with a protective fixing member thereby tosecure the first substrate and the semiconductor chip to each other, andsimultaneously polishing the second substrate and the semiconductor chipto the same thickness as each other.

According to yet further embodiment of the present invention, there isprovided an electronic apparatus having a display device, the displaydevice including a first substrate with a pixel switch and driversmounted thereon, a second substrate disposed in facing relation to thefirst substrate, a material layer held between the first substrate andthe second substrate and having peripheral edges sealed by a sealmember, the material layer having an electrooptical effect, and asemiconductor chip mounted as a COG component on the first substrate,the semiconductor chip having a control system for controlling thedrivers, the semiconductor chip having a thickness equal to the totalthickness of the seal member and the second substrate or larger than thethickness of the seal member and smaller than the total thickness.

According to another embodiment of the present invention, there isprovided an electronic apparatus having a display device, the displaydevice including a first substrate with a pixel switch and driversmounted thereon, a second substrate disposed in facing relation to thefirst substrate, a material layer held between the first substrate andthe second substrate and having peripheral edges sealed by a sealmember, the material layer having an electrooptical effect, a polarizingplate and phase difference plate combination disposed on the secondsubstrate remotely from the material layer, and a semiconductor chipmounted as a COG component on the first substrate, the semiconductorchip having a control system for controlling the drivers, thesemiconductor chip having a thickness smaller than the total thicknessof the seal member, the second substrate, and the polarizing plate andphase difference plate combination.

According to yet another embodiment of the present invention, there isprovided an electronic apparatus having a display device, the displaydevice including a first substrate with a pixel switch and driversmounted thereon, a second substrate disposed in facing relation to thefirst substrate, a material layer having an electrooptical effect, afirst polarizing plate and phase difference plate combination disposedbetween the first substrate and the material layer, a second polarizingplate and phase difference plate combination disposed between the secondsubstrate and the material layer, a seal member holding the materiallayer between the first and second polarizing plate and phase differenceplate combinations thereby to seal the material layer, and asemiconductor chip mounted as a COG component on the first substrate,the semiconductor chip having a control system for controlling thedrivers, the semiconductor chip having a thickness equal to or smallerthan the total thickness of the first and second polarizing plate andphase difference plate combinations, the material layer, and the secondsubstrate.

The above and other features and advantages of the present inventionwill become apparent from the following description when taken inconjunction with the accompanying drawings which illustrate a preferredembodiment of the present invention by way of example.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are cross-sectional views of a liquid crystal displaydevice according to a first embodiment of the present invention;

FIG. 2 is a cross-sectional view showing a first application of theliquid crystal display device according to the first embodiment;

FIG. 3 is a cross-sectional view showing a second application of theliquid crystal display device according to the first embodiment;

FIG. 4 is a cross-sectional view showing a third application of theliquid crystal display device according to the first embodiment;

FIG. 5 is a cross-sectional view of a liquid crystal display deviceaccording to a second embodiment of the present invention;

FIG. 6 is a cross-sectional view showing a first application of theliquid crystal display device according to the second embodiment;

FIG. 7 is a cross-sectional view showing a second application of theliquid crystal display device according to the second embodiment;

FIG. 8 is a cross-sectional view showing a third application of theliquid crystal display device according to the second embodiment;

FIG. 9 is a cross-sectional view showing a fourth application of theliquid crystal display device according to the second embodiment;

FIG. 10 is a cross-sectional view showing a fifth application of theliquid crystal display device according to the second embodiment;

FIGS. 11A and 11B are cross-sectional views illustrative of a polishingprocess of a method of manufacturing the liquid crystal display deviceaccording to the embodiments;

FIG. 12 is a circuit diagram, partly in block form, of a driver circuitfor use in the liquid crystal display devices according to the first andsecond embodiments;

FIGS. 13A and 13B are cross-sectional views of thin film transistors foruse in the liquid crystal display devices according to the first andsecond embodiments;

FIG. 14 is a table showing specifications achieved by a low-profileliquid crystal display device according to the embodiments of thepresent invention;

FIG. 15 is a cross-sectional view showing a basic structure of an ELdisplay device which includes no protective fixing member;

FIG. 16 is a cross-sectional view showing a basic structure of an ELdisplay device which includes a protective fixing member;

FIG. 17 is a perspective view of a cellular phone as a portableelectronic apparatus which can incorporate a display device according toan embodiment of the present invention; and

FIGS. 18A and 18B are cross-sectional views of a general liquid crystaldisplay device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(First Embodiment)

FIGS. 1A and 1B show in cross section a liquid crystal display deviceaccording to a first embodiment of the present invention. Specifically,FIG. 1A shows an overall cross-sectional structure of a liquid crystalpanel of the liquid crystal display device according to the firstembodiment, and FIG. 1B shows the cross-sectional structure in greaterdetail. According to the first embodiment, the liquid crystal panel hasa liquid crystal layer as a material layer having an electroopticaleffect.

As shown in FIGS. 1A and 1B, the liquid crystal display device,generally denoted by 1, includes a TFT (Thin Film Transistor) glasssubstrate 11 as a first transparent insulating substrate supportingthereon pixel switches and a driver circuit therefor which areconstructed of TFTs, a facing glass substrate 12 as a second transparentinsulating substrate disposed in facing relation to the TFT glasssubstrate 11, polarizing plate and phase difference plate combinations13, 14 mounted respectively on the TFT glass substrate 11 and the facingglass substrate 12, a liquid crystal layer (material layer) 16 heldbetween the TFT glass substrate 11 and the facing glass substrate 12 andhaving peripheral edges sealed by a seal member 15, and a semiconductorchip (COG chip) 17 including a control circuit for controlling thedriver circuit and mounted as a COG component on the TFT glass substrate11.

The COG chip 17 has a thickness T1 smaller than the total thickness T2of the facing glass substrate 12, the polarizing plate and phasedifference plate combination 14 mounted on the facing glass substrate12, and the seal member 15 (T1<T2). Because T1<T2, a metal frame 18 ofthe liquid crystal display device 1 is prevented from contacting theliquid crystal panel.

The COG chip 17 and the facing glass substrate 12 are simultaneouslypolished by a polishing material of alumina to equalize the thickness T1of the COG chip 17 and the total thickness T3 of the facing glasssubstrate 12 and the seal member 15 (T1=T3). Specifically, each of thethickness T1 and the thickness T3 may be set to 80 μm, for example.Details of the process of polishing the COG chip 17 and the facing glasssubstrate 12 will be described later with reference to FIG. 11A.

As shown in FIG. 1A, the liquid crystal display device 1 also includesthe metal frame 18 attached to liquid crystal panel referred to aboveand an OLED (Organic Light-Emitting Diode) backlight 19. Backlightemitted by the OLED backlight 19 is diffused by a diffusion sheet 31 andilluminates the liquid crystal panel from its rear side to allow theliquid crystal panel to display clear images through a color filtersubstrate, not shown. The outer surface of the OLED backlight 19 iscovered with a protective film 32.

FIGS. 2 through 4 show first through third applications, respectively,of the liquid crystal display device 1 according to the firstembodiment.

Those of the components shown in FIGS. 2 through 4 which are identicalto those shown in FIG. 1 are denoted by identical reference characters.

According to the first application shown in FIG. 2, the COG chip 17 hasa thickness smaller than the total thickness of the facing glasssubstrate 12 and the seal member 15.

Specifically, since the COG chip 17 can independently be mounted afterthe facing glass substrate 12, the seal member 15, and the TFT glasssubstrate 11 are formed, the liquid crystal panel can be fabricated suchthat the thickness T1 of the COG chip 17 and the total thickness T3 ofthe facing glass substrate 12 and the seal member 15 are related to eachother as T1<T3.

For example, the thickness T1 may be set to 60 μm and the thickness T3to 80 μm. The TFT glass substrate 11 and the facing glass substrate 12may be polished to the thickness of 80 μm.

According to the third application shown in FIG. 3, a protective fixingmember 30 is disposed between the COG chip 17 and the combination of thefacing glass substrate 12 and the seal member 15. Specifically, theprotective fixing member 30 is disposed around the COG chip 17.

The thickness T1 of the COG chip 17 and the total thickness T3 of thefacing glass substrate 12 and the seal member 15 are equal to each other(T1=T3).

The protective fixing member 30 is made of a silicon resin, a polyimideresin, or an ultraviolet-curable resin. The protective fixing member 30serves to prevent the pad of the COG chip 17 from being displacedhorizontally and vertically. The thickness T1 and the thickness T3 maybe set to 60 μm.

According to the third application shown in FIG. 4 which also includesthe protective fixing member 30, the thickness T1 of the COG chip 17 issmaller than the total thickness T2 of the facing glass substrate 12,the polarizing plate and phase difference plate combination 14 providedon the facing glass substrate 12, and the seal member 15 (T1<T2), and isalso smaller than the total thickness T3 of the facing glass substrate12 and the seal member 15 (T1<T3).

The polarizing plate and phase difference plate combination 13 may bedisposed between the TFT glass substrate 11 and the liquid crystal layer16, and the polarizing plate and phase difference plate combination 14may be disposed between the liquid crystal layer 16 and the facing glasssubstrate 12.

According to the first embodiment, the thickness of the COG chip 17mounted on the TFT glass substrate 11 is smaller than the totalthickness of the facing glass substrate 12, the polarizing plate andphase difference plate combination 14, and the seal member 15, therebymaking the liquid crystal panel low in profile. The thickness of theliquid crystal panel is finally determined by the device structure inthe display area thereof.

Since the COG chip 17 and the liquid crystal panel are reduced inthickness by the same polishing process, the fabrication process issimplified. The percentage of defective display devices is low because aplurality of processes are not required for reducing the thickness ofthe COG chip 17 and the liquid crystal panel.

The polarizing plate and phase difference plate combinations 13, 14 maybe disposed within the glass substrates 11, 12. With such a structure,since the polarizing plate and phase difference plate combinations 13,14 are not required to be applied as films, the overall fabricationprocess is shortened.

As the protective fixing member 30 is disposed around the COG chip 17,moisture and mobile ions are prevented from entering the COG chip 17,the TFT glass substrate 11, and the facing glass substrate 12. As aresult, images displayed on the liquid crystal panel are free of displayirregularities and metal interconnects in the liquid crystal panel areprevented from being corroded, so that the display device is made highlyreliable for a long period of time.

(Second Embodiment)

FIG. 5 shows in cross section a liquid crystal display device accordingto a second embodiment of the present invention.

As shown in FIG. 5, the liquid crystal display device, generally denotedby 2, includes: a TFT glass substrate 21 as a first transparentinsulating substrate supporting thereon pixel switches and a drivercircuit therefor which are constructed of TFTs; a facing glass substrate22 as a second transparent insulating substrate disposed in facingrelation to the TFT glass substrate 21; a liquid crystal layer 26positioned between the TFT glass substrate 21 and the facing glasssubstrate 22 and having peripheral edges sealed by a seal member 25;polarizing plate and phase difference plate combinations 23, 24 disposedbetween the TFT glass substrate 21 and the liquid crystal layer 26 andbetween the liquid crystal layer 26 and the facing glass substrate 22;the liquid crystal layer 26 being held between the polarizing plate andphase difference plate combinations 23, 24, and a COG chip 27 includinga control circuit for controlling the driver circuit and mounted as aCOG component on the TFT glass substrate 21.

The polarizing plate and phase difference plate combinations 23, 24 areformed as spin films or evaporated films in a process of forming TFTdevices in the facing glass substrate 22 or the TFT glass substrate 21.After the above process is finished, the TFT glass substrate 21 and thefacing glass substrate 22 are joined to each other with the seal member25 interposed therebetween, and the liquid crystal layer 26 is sealed.Therefore, the polarizing plate and phase difference plate combinations23, 24 can be formed in the lower and upper glass substrates 21, 22. Theliquid crystal display device 2 can thus be made lower in profile.

In the liquid crystal panel, the polarizing plate and phase differenceplate combinations 23, 24 are formed in the TFT glass substrate 21 andthe facing glass substrate 22, and the liquid crystal layer 26 is sealedbetween the polarizing plate and phase difference plate combinations 23,24. Since the COG chip 27, the facing glass substrate 22, the polarizingplate and phase difference plate combination 23, the seal member 25, andthe polarizing plate and phase difference plate combination 24 arepolished simultaneously. Therefore, the thickness T1 of the COG chip 27is equal to the total thickness T4 of the facing glass substrate 22, thepolarizing plate and phase difference plate combination 23, the sealmember 25, and the polarizing plate and phase difference platecombination 24 (T1=T4).

FIGS. 6 through 10 show first through fifth applications, respectively,of the liquid crystal display device 2 according to the secondembodiment.

According to the first application shown in FIG. 6, the protectivefixing member 30 is disposed between the COG chip 27 and the combinationof the facing glass substrate 22, the polarizing plate and phasedifference plate combination 24, the seal member 25, and the polarizingplate and phase difference plate combination 23, so that thickness T1 isequal to the thickness T4 (T1=T4). Specifically, the protective fixingmember 30 is disposed around the COG chip 27. The protective fixingmember 30 is made of the material described above and functions in themanner described above.

According to the second and third applications shown in FIGS. 7 and 8,the polarizing plate and phase difference plate combinations 23, 24 aredisposed inwardly of the seal member 25. With this arrangement, thethickness T1 of the COG chip 27 is equal to the total thickness T4 ofthe facing glass substrate 22 and the seal member 25 (T1=T4). Each ofthe thickness T1 and the thickness T4 is set to 80 μm, for example.

In the third application shown in FIG. 8, the protective fixing member30 is disposed between the COG chip 27 and the combination of the facingglass substrate 22 and the seal member 25, and disposed around the COGchip 27.

In FIGS. 7 and 8, the polarizing plate and phase difference platecombinations 23, 24 are disposed inwardly of the seal member 25 by whichthe liquid crystal layer 26 is sealed. The seal member 25 extendsbetween the TFT glass substrate 21 and the facing glass substrate 22 andis disposed laterally of the polarizing plate and phase difference platecombinations 23, 24 and the liquid crystal layer 26. With thisstructure, the bonding strength of the entire assembly is high.

According to the fourth and fifth applications shown in FIGS. 9 and 10,the thickness of the COG chip 27 and the total thickness of the facingglass substrate 22, the polarizing plate and phase difference platecombinations 23, 24, and the seal member 25 are reduced independently ofeach other.

Therefore, the COG chip 27 whose thickness has been reduced can bemounted on the liquid crystal panel whose thickness has been reduced.The thickness T1 of the COG chip 27 is smaller than the total thicknessT2 of the facing glass substrate 22, the polarizing plate and phasedifference plate combination 24, and the seal member 25 (T1<T2).

According to the second embodiment, as described above, the thickness ofthe COG chip 27 mounted on the TFT glass substrate 21 is smaller thanthe total thickness of the facing glass substrate 22, the polarizingplate and phase difference plate combination 24, and the seal member 25,making the liquid crystal panel lower in profile. The thickness of theliquid crystal panel is finally determined by the device structure inthe display area thereof.

Since the COG chip 27 and the liquid crystal panel can be reduced inthickness by the same polishing process, the fabrication process issimplified. The percentage of defective display devices is low because aplurality of processes are not required for reducing the thickness ofthe COG chip 27 and the liquid crystal panel.

The polarizing plate and phase difference plate combinations 23, 24 aredisposed within the glass substrates 21, 22. With such a structure,since the polarizing plate and phase difference plate combinations 23,24 are not required to be applied as films, the overall fabricationprocess is shortened.

As the protective fixing member 30 is disposed around the COG chip 27,moisture and mobile ions are prevented from entering the COG chip 27,the TFT glass substrate 21, and the facing glass substrate 22. As aresult, images displayed on the liquid crystal panel are free of displayirregularities and metal interconnects in the liquid crystal panel areprevented from being corroded, so that the display device is made highlyreliable for a long period of time.

A process of manufacturing a liquid crystal display device according tothe second embodiment will be described below.

FIG. 11A is illustrative of a process of polishing a liquid crystalpanel according to the present invention, and FIG. 11B is illustrativeof a process of polishing a liquid crystal panel in related art.

In FIGS. 11A and 11B, a liquid crystal panel 50 is polished by polishingdisks 51, 52 with abrasive particles 53 of alumina. The polishing disks51, 52 apply a polishing pressure to the liquid crystal panel 50 asindicated by the thick arrows.

In the polishing process, the COG chip 17 (27), the protective fixingmember 30, the TFT glass substrate 11 (21), and the facing glasssubstrate 12 (22) are polished to regions indicated by the dot-and-dashlines AA, BB until the thickness T1 of the COG chip 17 (27) and thecombined thickness T3 of the facing glass substrate 12 (22) and the sealmember 15 (25) are equal to each other (T1=T3 (0.08 mm)).

In FIG. 11A, after the liquid crystal panel having a thickness of 0.7 mmand the COG chip 17 (27) having a thickness of 390 μm are mounted inplace, the protective fixing member 30 is placed around the COG chip 17(27) and between the COG chip 17 (27) and the facing glass substrate 12(22), and the liquid crystal panel 50 and the COG chip 17 (27) aresecured to each other. Thereafter, the COG chip 17 (27), the protectivefixing member 30, the TFT glass substrate 11 (21), and the facing glasssubstrate 12 (22) start being polished with the abrasive particles 53 ofalumina. The liquid crystal panel 50 and the COG chip 17 (27) aresimultaneously polished until finally the thickness of the facing glasssubstrate 12 (22) of the liquid crystal panel 50 and the thickness ofthe COG chip 17 (27) are equal to each other.

Since the facing glass substrate 12 (22) is not provided on the COG chip17 (27), the polishing pressure is prevented from being lowered. Thethickness of the TFT glass substrate 11 (21) after it has been polishedis 0.08 mm, for example.

According to the process of polishing the liquid crystal panel inrelated art shown in FIG. 11B, the COG chip 17 (27) is polished with noprotective fixing member 30 being disposed therearound. Therefore, whenthe TFT glass substrate 11 (21) is thinned to a thickness smaller than0.1 mm, the portion of the TFT glass substrate 11 (21) which serves asthe pad for the COG chip 17 (27) is deformed and curved as indicated bythe arrow X under the pressure from the polishing disk 51, resulting ina reduction in the polishing pressure. At this time, the COG chip 17(27) has not yet been mounted in position. Therefore, the portion of theTFT glass substrate 11 (21) which serves as the pad for the COG chip 17(27) increases in thickness. Stated otherwise, the TFT glass substrate11 (21) suffers thickness irregularities.

As a result, since the TFT glass substrate 11 (21) tends to break if apolishing pressure is applied thereto, the pressure applied when the COGchip 17 (27) is to be mounted cannot be increased. Consequently, thecontact resistance of the pad at the COG chip 17 (27) increases, failingto provide a normal connection between the COG chip 17 (27) and theliquid crystal panel 50.

According to the manufacturing process shown in FIG. 11A, inasmuch as apolishing pressure can be applied from both the polishing disks 51, 52to the TFT glass substrate 11 (21) and the facing glass substrate 12(22), it is possible to polish the TFT glass substrate 11 (21) and thefacing glass substrate 12 (22) to uniform thicknesses.

Finally, the total thickness of the facing glass substrate 12 (22) andthe seal member 15 (25) may be reduced to 0.08 mm, and the thickness ofthe COG chip 17 (27) may be reduced to 0.08 mm.

In the process of manufacturing the liquid crystal display deviceaccording to the present embodiment, as described above, the COG chip 17(27) and the liquid crystal panel 50 can be thinned down in the samepolishing process. Accordingly, the fabrication process can besimplified, and the percentage of defective display devices is lowbecause a plurality of processes are not required for reducing thethickness of the COG chip 17 (27) and the liquid crystal panel 50.

FIG. 12 shows a circuit arrangement of a driver circuit of TFTs for usein the liquid crystal display devices according to the first and secondembodiments, and a time-division switch employed in the driver circuit.Specifically, FIG. 12 shows a time-division-energized active-matrixliquid crystal display device.

As shown in FIG. 12, the time-division-energized active-matrix liquidcrystal display device includes: a pixel switch 72 of pixels 71 arrangedin rows and columns; a vertical driver 73 for successively selectingrows of pixels 71 of a pixel switch 72; a horizontal driver 74 forwriting pixel signals in the pixels 71 of each of the selected rows; atime-division switch 75 for energizing the pixels 71 in a time-divisionfashion; and a control system 76 for controlling the vertical driver 73,the horizontal driver 74, and the time-division switch 75. The pixelswitch 72, the vertical driver 73, the horizontal driver 74, thetime-division switch 75, and the control system 76 are mounted on a LCDpanel 77.

The pixels 71 include respective TFTs 80 having respective gateelectrodes connected to gate lines 78-1 through 78-m and respectivesource electrodes connected to signal lines 79-1 through 79-n,respective liquid crystal cells 81 having pixel electrodes connectedrespectively to the drain electrodes of the TFTs 80, and respectiveauxiliary capacitors 82 having electrodes connected respectively to thedrain electrodes of the TFTs 80.

In each of the pixels 71, the liquid crystal cell 81 has a facingelectrode connected to a common line 83, and the auxiliary capacitor 82has the other electrode also connected to the common line 83. A DCvoltage is applied as a common voltage VCOM to the common line 83.

A time-division energization process will be described below. The signallines of the pixel switch 72 are divided into a plurality of blocks,each of which includes a plurality of adjacent signal lines. Thehorizontal driver 74 outputs from its output terminals respective signalvoltages in a time sequence to the signal lines in each of the blocks.The time-division switch 75, which is connected to the signal lines ineach of the blocks, samples in a time-division fashion the signalvoltages output in a time sequence from the horizontal driver 74, andapplies the sampled signal voltages to the signal lines.

To perform the time-division energization process, the horizontal driver74 outputs signal voltages in a time sequence to the signal lines ineach of the blocks.

The time-division switch 75 includes analog switches (transmissionswitches) for sampling in a time-division fashion the signal voltagesoutput in a time sequence from the horizontal driver 74. Thetime-division switch 75 has analog switches associated respectively withoutput terminals of the horizontal driver 74. In the illustratedembodiment, the time-division switch 75 performs a three-time-divisionprocess based on R (red), G (green), and B (blue) signals.

Specifically, the time-division switch 75 has three CMOS analog switches75-1, 75-2, 75-3 in the form of parallel P-channel MOS and N-channel MOStransistors. The analog switches 75-1, 75-2, 75-3 may be of a PMOS orNMOS configuration rather than the CMOS configuration.

In the time-division switch 75, the three analog switches 75-1, 75-2,75-3 have respective input terminals connected in common and respectiveoutput terminals connected respectively to the input terminals of threesignal lines 79-1, 79-2, 79-3. The input terminals of the analogswitches 75-1, 75-2, 75-3 are supplied with a signal voltage output fromthe horizontal driver 74.

Six control lines 89-1 through 89-6 are connected to the analog switches75-1, 75-2, 75-3 such that two control lines are connected to eachanalog switch. The analog switch 75-1 has two control input terminals(the gates of the CMOS transistors) connected to respective controllines 89-1, 89-2. The analog switch 75-2 has two control input terminalsconnected to respective control lines 89-3, 89-4. The analog switch 75-3has two control input terminals connected to respective control lines89-5, 89-6.

Gate selection signals S1 through S3, XS1 through XS3 for successivelyselecting the three analog switches 75-1, 75-2, 75-3 are given from atiming controller (TC) 90, to be described later, to the six controllines 89-1 through 89-6. The gate selection signals XS1 through XS3 arean inversion of the gate selection signals S1 through S3, respectively.

The gate selection signals S1 through S3, XS1 through XS3 successivelyturn on the three analog switches 75-1, 75-2, 75-3 in synchronism withthe signal voltages output in a time sequence from the horizontal driver74. The analog switches 75-1, 75-2, 75-3 sample the signal voltagesoutput in a time sequence from the horizontal driver 74 in athree-time-division fashion during a 1H period, and supply the sampledsignal voltages to the corresponding signal lines 79-1, 79-2, 79-3.

The control system 76 for controlling the vertical driver 73, thehorizontal driver 74, and the time-division switch 75 has a timingcontroller (TC) 90, a reference voltage generator 91, and a DC/DCconverter 92. The timing controller 90, the reference voltage generator91, and the DC/DC converter 92 are mounted, together with the verticaldriver 73, the horizontal driver 74, and the time-division switch 75, onthe LCD panel 77.

FIGS. 13A and 13B show cross-sectional structures of TFTs for use in theliquid crystal display devices according to the first and secondembodiments.

A horizontal driver and a selector are constructed of polysilicon TFTs,and a COG chip is used as a driver IC for converting a high-rate digitalsignal into an analog signal and supplying it as an image signal to aliquid crystal panel.

As shown in FIGS. 13A and 13B, polysilicon TFTs used as pixeltransistors making up a pixel switch and transistors making up a driverinclude bottom-gate polysilicon TFTs having a gate electrode disposedbeneath an oxide film and top-gate polysilicon TFTs having a gateelectrode disposed over an oxide film. The cross-sectional structures ofthese polysilicon TFTs are illustrated respectively in FIGS. 13A and13B.

The bottom-gate polysilicon TFT shown in FIG. 13A includes: a TFT glasssubstrate 41; a gate electrode 42 disposed on the TFT glass substrate41; a gate insulating film 43 disposed on the gate electrode 42; apolysilicon (Poly-Si) layer 44 disposed on the gate insulating film 43;and an interlayer insulating film 45 disposed on the polysilicon layer44.

A source region 46 and a drain region 47, each including an N+ diffusedlayer, are disposed on the gate insulating layer 43 laterally of thegate electrode 42. The source region 46 and the drain region 47 areconnected respectively to a source electrode 48 and a drain electrode49.

The top-gate polysilicon TFT shown in FIG. 13B includes a glasssubstrate 51, a polysilicon layer 52 disposed on the glass substrate 51,a gate insulating film 53 disposed on the polysilicon layer 52, a gateelectrode 54 disposed on the gate insulating film 53, and an interlayerinsulating film 55 disposed on the gate electrode 54.

A source region 56 and a drain region 57, each including an N+ diffusedlayer, are disposed on the glass substrate 51 laterally of thepolysilicon layer 52. The source region 56 and the drain region 57 areconnected respectively to a source electrode 58 and a drain electrode59.

According to the embodiments of the present invention, the thickness ofa semiconductor chip (the COG chip 17, 27) mounted as a COG component ona first transparent insulating substrate (the TFT glass substrate 11,21) is smaller than the total thickness of a second transparentinsulating substrate (the facing glass substrate 12, 22), polarizingplate and phase difference plate combinations (13, 14, 23, 24), and aseal member (15, 25), thereby making the liquid crystal panel low inprofile. The thickness of the liquid crystal panel is finally determinedby the device structure in the display area thereof.

FIG. 14 shows specifications achieved by a low-profile liquid crystalpanel for liquid crystal display device according to the presentinvention. In FIG. 14, the thicknesses of components of a liquid crystalpanel in related art and an inventive liquid crystal panel are shown forcomparison in a specification comparison table.

As shown in FIG. 14, if the COG chip 17 (27) becomes thinner, then sincethe thickness of the liquid crystal module depends on the thickness ofthe liquid crystal panel, the total thickness of the liquid crystalmodule including the metal frame 18 is reduced from 1.022 mm to 0.89 mm.

According to the embodiments of the present invention, as describedabove, the thickness of the COG chip 17 (27) mounted as a COG componenton the TFT glass substrate 11 (21) is smaller than the total thicknessof the facing glass substrate 12 (22), the polarizing plate and phasedifference plate combinations 14 (24), and the seal member 15 (25),thereby making the liquid crystal panel low in profile. The thickness ofthe liquid crystal panel is finally determined by the device structurein the display area thereof.

Since the COG chip 17 (27) and the liquid crystal panel are reduced inthickness by the same polishing process, the fabrication process issimplified. The percentage of defective display devices is low because aplurality of processes are not required for reducing the thickness ofthe COG chip 17 (27) and the liquid crystal panel.

The polarizing plate and phase difference plate combinations 23, 24 maybe disposed within the glass substrates 21, 22. With such a structure,since the polarizing plate and phase difference plate combinations 23,24 are not required to be applied as films, the overall fabricationprocess is shortened.

As the protective fixing member 30 is disposed around the COG chip 17(27), moisture and mobile ions are prevented from entering the COG chip17 (27), the TFT glass substrate 11 (21), and the facing glass substrate12 (22). As a result, images displayed on the liquid crystal panel arefree of display irregularities and metal interconnects in the liquidcrystal panel are prevented from being corroded, so that the displaydevice is made highly reliable for a long period of time.

In order to reduce the weight of the liquid crystal display device aswell as to reduce the thickness thereof, the TFT glass substrate 11 andthe facing glass substrate 12 may be replaced with respective first andsecond transparent insulating substrates made of an organic materialsuch as PET (PolyEthylene Terephthalate), PES (PolyEtherSulfone),acrylic resin, plastics, or the like.

In the above embodiments, the present invention has been described asbeing applied to liquid crystal display devices. However, the principlesof the present invention are also applicable to other display devicesincluding an EL display device including electroluminescence (EL) aselectrooptical elements in respective pixels.

FIGS. 15 and 16 show EL display devices 1A according to the presentinvention. As shown in FIGS. 15 and 16, the EL display devices 1A arefree of polarizing plate and phase difference plate combinations, andhave an EL layer 16A as a material layer instead of a liquid crystallayer.

Other details of the EL display devices shown in FIGS. 15 and 16 aresimilar to those of the liquid crystal display devices according to theabove embodiments.

The EL display device 1A shown in FIG. 15 includes no protective fixingmember, whereas the EL display device 1A shown in FIG. 16 includes aprotective fixing member. In FIGS. 15 and 16, the thickness of the COGchip 17 is equal to or smaller than the total thickness of the facingglass substrate 12 and the seal member 15. If the thickness of the COGchip 17 is smaller than the total thickness of the facing glasssubstrate 12 and the seal member 15, then the thickness of the COG chip17 is preferably greater than the thickness of the seal member 15.

The thickness of the COG chip 17 may be equal to or smaller than thedistance from the surface of the TFT glass substrate 11 which faces theEL layer 16A to the surface of the facing glass substrate 12 which facesaway from the EL layer 16A.

The display device according to the present invention can be used as adisplay device for use with OA apparatuses including personal computers,word processors, etc. and home appliances including TV receivers, etc.Particularly, the display device according to the present invention ispreferable for use as display units of electronic apparatuses which maybe portable terminals including cellular phones, PDAs (Personal DigitalAssistants), etc. whose overall assemblies are required to be low inprofile.

FIG. 17 shows in perspective a portable terminal as a cellular phonewhich can incorporate a display device according to an embodiment of thepresent invention.

As shown in FIG. 17, the cellular phone has a speaker 94, a display unit95, a control pad 96, and a microphone 97 which are mounted on a frontface of a casing 93 and arranged in a downward succession. The displayunit 95 may include the display device 1, 1A, or 2.

Since the cellular phone incorporates the display device according tothe present invention, the overall assembly thereof can be of a lowprofile because the display device is of a low profile.

Although certain preferred embodiments of the present invention havebeen shown and described in detail, it should be understood that variouschanges and modifications may be made therein without departing from thescope of the appended claims.

1. A display device comprising: a first substrate with a pixel switchand drivers mounted thereon; a second substrate disposed in facingrelation to said first substrate; a material layer held between saidfirst substrate and said second substrate and having peripheral edgessealed by a seal member, said material layer having an electroopticaleffect; a semiconductor chip mounted as a chip on glass (COG) componenton said first substrate, said semiconductor chip having a control systemconfigured to control said drivers; an organic light-emitting diode(OLED) backlight illuminating said first substrate from a rear side ofsaid first substrate through a diffusion sheet; and a protective fixingmember disposed on said first substrate only about a periphery of thesemiconductor chip in a uniform manner so that a top side and a bottomside of the protective fixing member are co-planar with a respective topside and a bottom side of the semiconductor chip, the protective fixingmember serving to fix the first substrate to the semiconductor chip andseal about the periphery of the semiconductor chip; wherein, saidsemiconductor chip has a thickness greater than a thickness of the sealmember, and the thickness of the semiconductor chip is equal to or lessthan a total thickness of said seal member and said second substrate,each of said semiconductor chip and said second substrate includes apolished surface.
 2. The display device according to claim 1, whereinthe protective fixing member is at least in part between thesemiconductor chip and the seal member, the protective fixing membersecures the semiconductor chip to the first substrate, prevents moistureand mobile ions from entering the semiconductor chip, and preventshorizontal and vertical displacement of the semiconductor chip.
 3. Adisplay device comprising: a first substrate with a pixel switch anddrivers mounted thereon; a second substrate disposed in facing relationto said first substrate; a material layer held between said firstsubstrate and said second substrate and having peripheral edges sealedby a seal member, said material layer having an electrooptical effect; asemiconductor chip mounted as a chip on glass (COG) component on saidfirst substrate, said semiconductor chip having a control systemconfigured to control said drivers; a protective fixing member disposedon at least a portion of said first substrate only laterally of saidsemiconductor chip in a uniform manner so that a top side and a bottomside of the protective fixing member are co-planar with a respective topside and a bottom side of the semiconductor chip, the protective fixingmember serving to fix the first substrate to the semiconductor chip andseal about a periphery of the semiconductor chip; an organiclight-emitting diode (OLED) backlight illuminating said first substratefrom a rear side of said first substrate through a diffusion sheet,wherein, said semiconductor chip has a thickness equal to or smallerthan the distance from a surface of said first substrate which facessaid material layer to a surface of said second substrate which facesaway from said material layer, and each of said semiconductor chip andsaid second substrate includes a polished surface.
 4. A display devicecomprising: a first substrate with a pixel switch and drivers mountedthereon; a second substrate disposed in facing relation to said firstsubstrate; a material layer held between said first substrate and saidsecond substrate and having peripheral edges sealed by a seal member,said material layer having an electrooptical effect; a polarizing plateand phase difference plate combination disposed on said second substrateremotely from said material layer; a semiconductor chip mounted as achip on glass (COG) component on said first substrate, saidsemiconductor chip having a control system configured to control saiddrivers; a protective fixing member disposed only around a periphery ofthe COG component in a uniform manner between the COG component and theseal member on the first substrate so that a top side and a bottom sideof the protective fixing member are co-planar with a respective top sideand a bottom side of the COG component, the protective fixing memberserving to fix the first substrate to the COG component and seal theperiphery of the semiconductor chip; and an organic light-emitting diode(OLED) backlight illuminating said first substrate from a rear side ofsaid first substrate through a diffusion sheet, wherein, saidsemiconductor chip has a thickness smaller than the total thickness ofsaid seal member, said second substrate, and said polarizing plate andphase difference plate combination, and at least said semiconductor chipincludes a polished surface.
 5. The display device according to claim 4,wherein said semiconductor chip has a thickness equal to or smaller thanat least the total thickness of said seal member and said secondsubstrate and the thickness of said semiconductor chip is greater than athickness of said seal member.
 6. The display device according to claim4, wherein the protective fixing member prevents the COG component frombeing displaced horizontally or vertically.
 7. The display deviceaccording to claim 5, wherein the protective fixing member preventsmoisture and mobile ions from entering the COG component.
 8. Theelectronic apparatus having a display device, said display devicecomprising: a first substrate with a pixel switch and drivers mountedthereon; a second substrate disposed in facing relation to said firstsubstrate; a material layer held between said first substrate and saidsecond substrate and having peripheral edges sealed by a seal member,said material layer having an electrooptical effect; a semiconductorchip mounted as a chip on glass (COG) component on said first substrate,said semiconductor chip having a control system configured to controlsaid drivers; a protective fixing member disposed on said firstsubstrate only laterally around the semiconductor chip in a uniformmanner so that a top side and a bottom side of the protective fixingmember are co-planar with a respective top side and a bottom side of thesemiconductor chip, the protective fixing member serving to fix thesemiconductor chip to the first substrate and provide a seal about aperiphery of the semiconductor chip; and an organic light-emitting diode(OLED) backlight illuminating said first substrate from a rear side ofsaid first substrate through a diffusion sheet; and wherein, saidsemiconductor chip has a thickness greater than a thickness of the sealmember, and the thickness of the semiconductor chip is equal to or lessthan a total thickness of said seal member and said second substrate;and each of said semiconductor chip and said second substrate includes apolished surface.
 9. The electronic apparatus having a display device,said display device comprising: a first substrate with a pixel switchand drivers mounted thereon; a second substrate disposed in facingrelation to said first substrate; a material layer held between saidfirst substrate and said second substrate and having peripheral edgessealed by a seal member, said material layer having an electroopticaleffect; a polarizing plate and phase difference plate combinationdisposed on said second substrate remotely from said material layer; asemiconductor chip mounted as a chip on glass (COG) component on saidfirst substrate, said semiconductor chip having a control systemconfigured to control said drivers; a protective fixing member disposedonly laterally around the COG component in a uniform manner between theCOG component and the seal member on the first substrate so that a topside and a bottom side of the protective fixing member are co-planarwith a respective top side and a bottom side of the COG component, theprotective fixing member serving to fix the first substrate to thesemiconductor chip and seal about a periphery of the semiconductor chip;and an organic light-emitting diode (OLED) backlight illuminating saidfirst substrate from a rear side of said first substrate through adiffusion sheet, wherein, said semiconductor chip has a thicknesssmaller than the total thickness of said seal member, said secondsubstrate, and said polarizing plate and phase difference platecombination, and at least said semiconductor chip includes a polishedsurface.
 10. The display device according to claim 1, furthercomprising: a polarizing plate and phase difference plate combinationdisposed on said second substrate remotely from said material layer,wherein said thickness and said total thickness are 60 μm.
 11. Thedisplay device according to claim 1, wherein an outer surface of theOLED backlight is covered by a protective film.
 12. The display deviceaccording to claim 3, wherein an outer surface of the OLED backlight iscovered by a protective film.
 13. The display device according to claim1, wherein said protective fixing member is disposed around thesemiconductor chip including between the semiconductor chip and acombination of said second substrate and said seal member, wherein theprotective fixing member is selected from the group consisting of:silicon resin, polyimide resin, and ultraviolet curable resin.
 14. Thedisplay device according to claim 3, wherein the thickness of saidsemiconductor chip is greater than a thickness of said seal member, andsaid protective fixing member is disposed around the semiconductor chipincluding between the semiconductor chip and a combination of saidsecond substrate and said seal member, wherein the protective fixingmember is selected from the group consisting of: silicon resin,polyimide resin, and ultraviolet curable resin.
 15. The display deviceaccording to claim 4, wherein he protective fixing member is selectedfrom the group consisting of: silicon resin, polyimide resin, andultraviolet curable resin.
 16. The display device according to claim 8,wherein protective fixing member is disposed only around thesemiconductor chip including between the semiconductor chip and acombination of said second substrate and said seal member, wherein theprotective fixing member is selected from the group consisting of:silicon resin, polyimide resin, and ultraviolet curable resin.
 17. Thedisplay device according to claim 9, wherein the protective fixingmember is selected from the group consisting of: silicon resin,polyimide resin, and ultraviolet curable resin.
 18. The display deviceaccording to claim 4, wherein said thickness and said total thicknessare either 60 or 80 μm.